Semi Automatic wire bonding machine Tin soldering machine soldering robot soldering station

Semi Automatic wire bonding machine Tin soldering machine soldering robot soldering station 

1. Semi-Automatic Wire Bonding Machine

Core Functionality for Microelectronics

• Wire Bonding Precision:
  • Uses gold/copper wire (15–75μm diameter) to connect IC chips to lead frames or PCBs via thermosonic or ultrasonic bonding, achieving ±1μm positioning accuracy for fine-pitch bonds (e.g., 25μm pitch in semiconductor packaging).
• Semi-Automatic Operation:
  • Manual stage positioning of the workpiece, with automatic wire feeding and bonding (ball bonding or wedge bonding) controlled by foot pedal or touchscreen.
• Key Features:
  • Bonding Force Control: Adjustable ultrasonic power (5–50W) and pressure (10–200gf) to suit different wire materials and chip sizes.
  • Vision System: Microscope with 10×–50× magnification for manual alignment of bonding points, the soldering machine can be used for LED soldering.

Application Scenarios:

• Semiconductor packaging (ICs, diodes, transistors).
• LED chip bonding in lighting modules.

2. Tin Soldering Machine (Semi-Automatic)

Tin Soldering Efficiency & Versatility

• Solder Feeding Mechanism:
  • Motor-driven automatic solder wire dispenser (0.5–1.2mm diameter) with ±0.1mm precision, triggered by foot pedal, reducing manual solder handling.
• Temperature Control:
  • PID-regulated soldering iron (200–450°C, ±5°C stability) for leaded/lead-free solder, suitable for through-hole and SMD components.
• Ergonomic Design:
  • Lightweight handpiece (150–300g) with heat-resistant grip, ideal for 8+ hour operation in PCB assembly or repair.

Application Scenarios:

• Consumer electronics production (USB cables, power adapters).
• LED strip light soldering (resistors, connectors).

3. Soldering Robot (Automatic Soldering System)

High-Axis Automation & Precision

• Multi-Axis Motion Control:
  • 4–6 axis robotic arm with ±0.02mm repeatability, enabling complex trajectories (e.g., angled soldering on 3D PCBs) at speeds up to 300mm/s.
• Intelligent Programming:
  • Teach pendant or CAD file import for batch soldering, with AI-optimized parameters (temperature, solder volume) based on component type.
• Advanced Technologies:
  • Laser soldering (980nm) for micro-components or ultrasonic soldering for cold welding fine wires (30–40AWG).

Application Scenarios:

• Mass production of PCBs for automotive, medical devices.
• High-reliability soldering (ISO 13485 compliance).

4. Soldering Station (Benchtop Workstation)

Versatility & User-Friendly Operation

• Modular Tooling:
  • Interchangeable tips (chisel, conical, needle) for SMD (0201) to through-hole components, with quick-change mechanisms (≤10s).
• Precision Controls:
  • Digital display with PID temperature control (150–480°C, ±1°C), presets for different soldering tasks (e.g., SMD: 320°C, through-hole: 350°C).
• Safety Features:
  • ESD grounding (≤10⁹Ω), auto-sleep (150°C after 2min idle), and fume extraction port.

Application Scenarios:

• PCB repair and rework (BGA/CSP desoldering).
• Prototyping in R&D labs or hobbyist projects.

Product Parameter:  

Product Description:

This semi-automatic soldering machine combines advanced technology with exquisite craftsmanship to bring efficient and accurate welding solutions to the electronics manufacturing industry. It uses an intelligent temperature control system, which can accurately control the solder temperature to ensure stable and reliable solder joint quality. No matter in the face of complex circuit boards or fine electronic components, it can be easily handled to achieve perfect welding.

Its unique tin feeding device is exquisitely designed, and the tin feeding speed is uniform and stable, which can be flexibly adjusted according to different needs. The operation interface is simple and intuitive, easy to use, and even beginners can quickly master the operation skills. At the same time, the equipment has good stability and durability, and through strict quality testing, it can maintain excellent performance in high-intensity work for a long time.

The semi-automatic soldering machine is widely used in electronic assembly, electrical maintenance, communication equipment manufacturing and other fields, which provides strong support for enterprises to improve production efficiency, reduce costs and improve product quality. Choose our brand, is to choose professional and quality.

Detail Photos: